Readout Integrated Circuits

TUMSIS has more than 10 years of experience in the fields of readout electronic circuits (ROIC) for photovoltaic infrared detectors. We have successfully completed many projects and we are holding innovative patents regarding this area. Main focus of TUMSIS is designing ROIC of hybrid focal plane arrays. TUMSIS is capable of designing ROIC, that is operated in both room and cryogenic temperatures, for all infrared bands (NIR, SWIR, MWIR, LWIR and VLWIR). TUMSIS always applies to its performance oriented patented ideas to ROIC designs in order to provide competitive products.

TUMSIS also actively working on custom CMOS image sensor designs for medical, industrial, defemce and space applications by applying its vision of developing innovative products.

ROIC Capabilities

  • Custom ROIC Design: Digital and Analog ROIC for UV, X-Ray and Infrared (IR) Detectors operable in both cryogenic and room temperatures.
  • Pixel Design: Direct Injection (DI), capactive transimpedance amplifier (CTIA), source follower per detector (SFD), active pixel sensor (APS), under pixel digital conversion (DROIC).
  • Signal Chain: Digital and analog time delay integration (TDI), correlated double sampling (CDS), amplifiers, comparators, switched capacitor amplifiers, ADCs.
  • Periphery Circuits: Biases, current and voltage references, output buffers, DACs, LVDS driver and receivers.

  • [top]


    Self-Reset Asynchronous Pulse Frequency Modulated DROIC With Extended Counting And Having Reduced Quantization Noise


    The present invention describes a digital readout with pulse frequency modulation and extended counting that achieves superior quantization noise performance. The invention benefits the wide dynamic range of conventional CMOS image sensors while reducing the quantization noise through per pixel analog to digital conversion

    Advantages Very Large Charge Handling Capacity, Better Linearity and Uniformity, Very High SNR Performance, All Digital Circuit

    Pixel Level Digital Implementation of Time Delay Integration (TDI) Algorithm for Low Noise, High Dynamic Range and Low Power Readout Integrated Circuits (ROIC)


    A smart and cost effective pixel level digital implementation of time delay integration(TDI) algorithm for low noise, high dynamic range, low power readout integrated circuits (ROIC) occupying small chip area.

    Advantages Pixel Level AD Conversion, Low Quantization Noise, Low Power Consumption, Small Area, High Dynamic Range, Less Non-Uniformity

    Large Format Short Wave Infrared (SWIR) Focal Plane Array (FPA) With Low Noise And High Dynamic Range


    Following invention presents unit cell architecture for infrared imaging, which has two input stages covering for both low and high light levels, and automatic input selection circuitry inside to extend dynamic range. This invention helps to extend dynamic range of near visible (NIR) and short wave infrared (SWIR) image sensors by improving SNR value. Some ideas inside architecture can be utilized for MWIR and LWIR imaging sensors.

    Advantages High Dynamic Range, Very Low Noise, Compatible with Dual Color Detectors, High Flexibility with Automatic and Manuel Modes